发明名称 |
WIRING BOARD, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING THOSE |
摘要 |
A wiring board includes plural terminals, an insulating layer, and recess portions. Each terminal includes a roughened upper surface and a roughened side surface. The insulating layer is formed between the terminals. The upper surfaces of the terminals are exposed. An upper surface of the insulating layer is a concave curved surface. The recess portions are formed in the insulating layer around the terminals so as to partially expose the side surfaces of the terminals. |
申请公布号 |
US2016174379(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
US201514962527 |
申请日期 |
2015.12.08 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
Shimizu Noriyoshi;Arisaka Hiromu;Rokugawa Akio;Koyama Toshinori |
分类号 |
H05K1/18;H05K1/11 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
1. A wiring board comprising:
plural terminals each including a roughened upper surface and a roughened side surface; an insulating layer that is formed between the terminals, the upper surfaces of the terminals being exposed, an upper surface of the insulating layer being a concave curved surface, and recess portions that are formed in the insulating layer around the terminals so as to partially expose the side surfaces of the terminals. |
地址 |
Nagano-shi JP |