发明名称 WIRING BOARD, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING THOSE
摘要 A wiring board includes plural terminals, an insulating layer, and recess portions. Each terminal includes a roughened upper surface and a roughened side surface. The insulating layer is formed between the terminals. The upper surfaces of the terminals are exposed. An upper surface of the insulating layer is a concave curved surface. The recess portions are formed in the insulating layer around the terminals so as to partially expose the side surfaces of the terminals.
申请公布号 US2016174379(A1) 申请公布日期 2016.06.16
申请号 US201514962527 申请日期 2015.12.08
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 Shimizu Noriyoshi;Arisaka Hiromu;Rokugawa Akio;Koyama Toshinori
分类号 H05K1/18;H05K1/11 主分类号 H05K1/18
代理机构 代理人
主权项 1. A wiring board comprising: plural terminals each including a roughened upper surface and a roughened side surface; an insulating layer that is formed between the terminals, the upper surfaces of the terminals being exposed, an upper surface of the insulating layer being a concave curved surface, and recess portions that are formed in the insulating layer around the terminals so as to partially expose the side surfaces of the terminals.
地址 Nagano-shi JP