| 摘要 |
An IC contactor including a plurality of contact pins arranged in a line near a periphery of an IC receiving member so as to correspond to a plurality of external lead pins of an IC, mounted on the receiving member. The contact pins include a plurality of first contact pins and a plurality of second contact pins arranged alternately. The first contact pins each have a projecting portion projected in a downward direction, and the second contact pins each have a projecting portion projected in an upward direction. First separators are each interposed between the projecting portions of adjacent first contact pins, and second separators are each interposed between the projecting portions of adjacent second contact pins. Since the directions in which the projection portions of the first and second contact pins are projected are opposite from each other, the separators can be arranged alternately on different lines. Therefore, the contact pins and separators each have a sufficient width, and the width of each contact pin can be made greater than that of each of external lead pins of the semiconductor package. |
