| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for power module with a heat sink capable of suppressing occurrence of crack, or the like, on the bonding interface, even when a severe heat cycle is loaded.SOLUTION: In a substrate for power module with a heat sink including an insulation layer and a circuit layer and a heat sink 31, the bonding surface of the metal layer 13 to the heat sink 31, and the bonding surface of the heat sink 31 to the metal layer 13 are composed of copper or a copper alloy, the metal layer 13 and heat sink 31 are bonded by solid phase diffusion bonding via a bonding material composed of aluminum or an aluminum alloy, a diffusion bonding layer 40 having an intermetallic compound of Al and Cu is formed on the bonding interface of the metal layer 13 and heat sink 31, and the thickness tof a θ phase 42 is 5 μm or less in the diffusion bonding layer 40.SELECTED DRAWING: Figure 3 |
