| 摘要 |
PROBLEM TO BE SOLVED: To realize a long life of a pad, rapid polishing velocity and improvement of velocity stability by executing conditioning of a polishing pad in a field before polishing is finished while a board is on a pad. SOLUTION: In the embodiment, field conditioning is finished before a polishing process is finished; however, conditioning of a polishing pad 22 by using a conditioner 29 is started about one minute before a board 27 attains the pad 22. After one minute passed, conditioning is executed while a semiconductor element board 27 with an insulation layer is polished. After about one and a half minutes, conditioning is finished and polishing is further continued for about one minute. Since both a second conditioning arm and a second conditioner can be used, polishing function can be enlarged and conditioning is possible outside a site. |
