| 摘要 |
PROBLEM TO BE SOLVED: To avoid edge touch with no lowered bonding speed, by detecting position and height of a bonding pad and an inner lead of a lead frame, and automatically calculating and controlling a bonding parameter for capillary operation. SOLUTION: To a first calculation part, such data as deviation amount and inclination for relative position between an semiconductor element and an inner lead detected with a recognition part 27, and data 32 of registered bonding coordinate are sent, and distance L of a first and second bonding points is calculated. In addition, to a second calculation part, height data of to-be- bonded parts of the semiconductor element and the inner lead detected with the recognition part 27 is sent, for calculating a bonding step D. The distance L, the step D, and a distance E between a bonding pad and the edge of semiconductor element, stored in a storage part 26, are sent to a third calculation part, and such parameter as to obtain an optimum loop shape relating to the distance between a wire and the edge of semiconductor element is calculated. |
