| 发明名称 |
Using laser light to make solder connections |
| 摘要 |
<p>A semiconductor component (5) of the Ball Grid Array type is soldered in a grid array (6) on the underside of a printed circuit board (PCB) (1). Instead of heating the whole assembly to the melting point of solder, laser light is directed selectively to form each solder ball (3). Preheating could be used. Laser energy could be pulsed.</p> |
| 申请公布号 |
NL1007949(C1) |
申请公布日期 |
1999.02.08 |
| 申请号 |
NL19981007949 |
申请日期 |
1998.01.05 |
| 申请人 |
LEONARDUS MATHEUS THEODORUS VOSS;MATHEUS ANTONIUS BERKERS |
发明人 |
LEONARDUS MATHEUS THEODORUS VOSS |
| 分类号 |
H01R43/02;H05K3/34;(IPC1-7):H01R4/02 |
主分类号 |
H01R43/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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