发明名称 CARRIER MATERIAL FOR HOLDING ARTICLE TO BE GROUND
摘要 PROBLEM TO BE SOLVED: To suppress a hole end surface for fitting a carrier material gear part or an article to be ground from being worn out by forming a thermosetting resin in the surface of at least one side of a metal plate and reducing a friction force between the surface of the carrier material and a pad. SOLUTION: A thermosetting resin layer formed in a metal plate surface is made gradually thinner during grinding. If too thin from the beginning, the exposing time of the metal plate comes early and a friction force is increased. On the other hand, if the thermosetting resin layer is formed thick, even by adjusting the dry state of a thermosetting resin coated on a mold-releasing base material, the thermosetting resin is scratched because of the flow shortage of the resin during forming, or conversely, the flow of the resin in a peripheral part is considerable to make the peripheral part thin. The range of adjusting the drying degree (hardness) of the thermosetting resin is greatly narrowed, and control becomes difficult. Thus, the thickness of the thermosetting resin layer is preferably set in a range of 10 to 200 μm.
申请公布号 JPH1133895(A) 申请公布日期 1999.02.09
申请号 JP19970192333 申请日期 1997.07.17
申请人 SHIN KOBE ELECTRIC MACH CO LTD 发明人 SAKAGUCHI TATSU;KAWAMURA TSUNEO;KISHIDA SHINICHI
分类号 B24B37/22;B24B37/24;B24B37/27;B24B37/28 主分类号 B24B37/22
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