| 摘要 |
<p>Apparatus is provided for rapidly and simultaneously inserting electronic circuit packages into sockets on burnin boards. A quantity of dual in-line packages (DIPs) is placed in registry with an equal number of sockets on a burnin board, and the pins are inserted into the sockets. However, the pressure applied to each DIP during insertion into the burn-in board is limited, so that no damage can be done to a DIP on which the leads are not in registry with the sockets. Thus, if a bent lead prevents proper insertion of the DIP into the socket, the DIP is not damaged, nor is the bent pin further damaged.</p> |
