发明名称 PATTERN FORMING PROCESS
摘要 PURPOSE:To simplify the titled process reducing the required time remarkably by a method wherein reacting material formed by photochemical initiation adheres to a substrate to form patterns. CONSTITUTION:ArF excimer laser beams are focussed on a silicon substrate 4 through a melted rock crystal window 5 using a melted rock crystal lens 3 to image a mask 2 on the silicon substrate 4. Gas mixture comprising monosilane SiH4 and laughing gas N2O as reacting material is introduced into a vacuum vessel while SiO2 is separated to adhere to a position of substrate 4 where imaging beams are irradiated. Infrared parallel beams 8 are focussed on the image through the lens 3 to heat the substrate 4 up to the temperature exceeding 250 deg.C forming a transparent and very adhesive SiO2 film. Similar patterns suitable for mass production may be transferred constantly since mechanical movements may be reduced by means of utilizing a mask.
申请公布号 JPS59161038(A) 申请公布日期 1984.09.11
申请号 JP19830034539 申请日期 1983.03.04
申请人 HITACHI SEISAKUSHO KK 发明人 KIMURA SHIGEJI;TAKAMI KATSUMI
分类号 H01L21/205;C23C16/04;H01L21/31;H01L21/316 主分类号 H01L21/205
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