| 摘要 |
PURPOSE:To acquire an electrode chip which is narrower than that of ball bonding and to realize cost reduction by wire-bonding a connection between an electrode and an insulating substrate through a wedge bond method. CONSTITUTION:A realy area 8 which is formed to an insulating substrate 7 provided on a load frame 9 and an electrode 2 of an IC chip 1 are connected by a metal fine line 6 using wedge bond method. In this case, the realy area 8 and an inner lead 5 can be also connected through the wedge bond method like the connection of the realy area 8 and the electrode 2. Furthermore, the relay area 8 can be used not only as a realy but also as a circuit wiring on an insulating substrate 7. Thereby, an electrode pitch which is narrower than that usable for ball bonding can be realized enabling cost reduction. |
