| 摘要 |
A method of fabricating a multilayer structure, comprising:- (a) forming a first electrically conductive layering (2, 3); (b) providing a resist layer (4) with a via hole (4A), said via hole being located on said first electrically conductive layering; (c) forming a via lead (5) in said via hole by electrically plating a metal therein; (d) removing said resist layer (4); (e) forming an insulative layer (7-1) over said first electrically conductive layering (2, 3) and said via lead (5); (f) etching a surface part of said insulative layer (7-1) until a top part of said via lead (5) protrudes by a predetermined height from the etched surface of said insulative layer; and (g) forming a second electrically conductive layering (8; 8, 9) over said insulative layer (7-1) and over the protruding part of said via lead (5). A multi layer structure comprising:- a first electrically conductive pattern (3); an insulative layer (7-1) formed over said first electrically conductive pattern (3); an electrically conductive via lead (5) connected from said first pattern (3) through said insulative layer (7-1), a top of said via lead protruding from a surface of said insulative layer (7-1); and a second electrically conductive pattern (9) formed on said first insulative layer (7-1) and over said protruding top of said via lead (5). <IMAGE> |
