发明名称 IC CHIP ELECTRODE CONNECTION STRUCTURE OF NONCONTACT TAG
摘要 PROBLEM TO BE SOLVED: To obtain excellent electric connection even when metal which has a high-insulation oxide film easily produced on its surface by activation is used as a material of an electrode by connecting a chip electrode part to a counter electrode part at a specific tilt angle by intruding the edge part of the chip electrode part into the counter electrode. SOLUTION: When the chip electrode part of an IC chip 1 is stuck on a chip counter electrode part 4a, the edge part 6A is intruded into the counter electrode part 4a at the specific tilt angle (e.g. about 30 deg.). Namely, a couple of chip electrodes 3 are provided for every IC chip 1, the edge part 6A on one short side of each electrode part 3 is intruded into the chip counter electrode part 4a, and the other short side of the chip electrode part 3 is fixed to the chip counter electrode part 4a with a conductive adhesive 5. An aluminum oxide (Al2 O3 ) film formed on the chip counter electrode part 4a is broken to obtain excellent electric connection between the chip electrode part 3 and chip counter electrode part 4a.
申请公布号 JPH1153501(A) 申请公布日期 1999.02.26
申请号 JP19970215220 申请日期 1997.08.08
申请人 MITSUBISHI HEAVY IND LTD 发明人 KUROMARU HIROSHI;KIRIYAMA SATOSHI;ATSUMI MAKIO
分类号 B42D15/10;G01S13/75;G01S13/76;G01S13/79;G06K19/07;G06K19/077;H04B5/02 主分类号 B42D15/10
代理机构 代理人
主权项
地址