发明名称 BUMP BONDING EQUIPMENT AND METHOD
摘要 PROBLEM TO BE SOLVED: To eliminate imperfect bonding and improve reliability, by applying a regulating force to an electronic component with a regulating plate, and relieving a stress applied to a corner part of the component, in such a manner that the corner part of the component abuts against a positioning plate and the regulating plate rotates at the same time as the abutting. SOLUTION: One side of an electronic component 3 is retained by a plate 4, and other two sides are retained by the side parts of a regulating plate 2. By a regulating spring 5, a regulating force is applied in the spring direction to the regulating plate 2, which is rotatably installed by setting a fulcrum 6 as a center. The regulating plate 2 rotates around the fulcrum 6 as the center, while the regulating force is applied in the springing direction. When a corner part of the electronic component 3 abuts against the positioning plate 4 in the case of position regulation of the electronic component 3, the regulating plate 2 rotates at the same time as the abutting. As a result, the stress applied to the corner part of the component 3 is relieved, and damage of the corner part of the component 3 can be prevented. The electronic component 3 is brought into contact with the respective surfaces of the regulating plate 2 and the plate 4, and the position is regulated.
申请公布号 JPH1154515(A) 申请公布日期 1999.02.26
申请号 JP19970207492 申请日期 1997.08.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YOSHIDA KOICHI;IMANISHI MAKOTO;AZUMA KAZUJI;YAMAMOTO AKIHIRO;HIROYA KOJI;YONEZAWA TAKAHIRO;EGUCHI SHINZO;OTANI HIROYUKI
分类号 H01L21/60;H01L21/321;H01L21/68 主分类号 H01L21/60
代理机构 代理人
主权项
地址