| 摘要 |
PROBLEM TO BE SOLVED: To enable easy connection by ground of a package, outer lead pads for a power source and signals, and bonding wires, when intervals and arrangement of inner lead pads for ground, a power source and signals of an LSI are changed, and enable connection in the same manner when the size of an LSI is changed. SOLUTION: In an LSI provided with inner lead pads 2 for ground, inner lead pads 3 for a power source and inner lead pads 4 for signals, an outer lead pad 7 for ground of a package and an outer lead pad 8 for a power source are arranged in parallel with the row of pads 2, 3 and 4. The outer lead pads 7 for ground of the package and the outer lead pads 8 for the power source are formed in a ring type. Each of the inner lead pads and each of the outer lead pads of the LSI 1 are connected by using each bonding wire 6. |
