发明名称 |
DEVICE FOR DISSIPATING HEAT FROM A HEAT SOURCE LOCATED IN A HOUSING |
摘要 |
According to the invention, the device has a primary cooling element (K1) located inside a housing (G) and a secondary cooling element (K2) located outside the housing (G). The cooling elements are connected via a heat conduction element (P), in order to dissipate heat from the housing (G), said connection being heat-conductive and mechanically moveable. The inventive device for dissipating heat has the particular advantage of drastically reducing the risk of hairline cracks forming in the heat conduction element (P) as a result of vibrations, and could therefore be used effectively in an industrial environment. |
申请公布号 |
WO9842169(A3) |
申请公布日期 |
1999.02.25 |
申请号 |
WO1998DE00670 |
申请日期 |
1998.03.06 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;RIEGER, GOTTFRIED;TIRPITZ, MICHAEL |
发明人 |
RIEGER, GOTTFRIED;TIRPITZ, MICHAEL |
分类号 |
G06F1/20;H01L23/427 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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