发明名称 |
Bi-planar multi-chip module |
摘要 |
A bi-planar multi-chip package has die mounted on both sides of an insulating flexible carrier. The die are located in two parallel planes, with the flexible carrier located on a third plane between the two die planes. The die are mounted with the active circuit area facing each other on opposing sides of the flexible carrier. The carrier has conductive layers forming interconnect traces on both sides, and through-vias for connecting traces on opposite sides. The opposing die are mounted to the carrier with a solder-bump process with opposing pads located directly opposite each other. Vias are located in close proximity to the pads, between adjacent pads on the flexible carrier. Because the vias are between two adjacent pads, the interconnect length between two pads is on the order of the pad pitch. Thus opposing pads on the two die may be connected through the adjacent via with a small interconnect length. |
申请公布号 |
US5477082(A) |
申请公布日期 |
1995.12.19 |
申请号 |
US19940179904 |
申请日期 |
1994.01.11 |
申请人 |
EXPONENTIAL TECHNOLOGY, INC. |
发明人 |
BUCKLEY, III, FREDERICK;BLOMGREN, JAMES S. |
分类号 |
H01L23/538;H01L25/16;(IPC1-7):H01L23/12;H01L23/488 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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