SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To realize a semiconductor device which can effectively dissipate heat generated from a pellet, when the temperature of either a circuit board or outside air is high. SOLUTION: A pellet 2 is mounted on the upper surface of the central part 9 of a heat sink 3. Both end portions 10 of the heat sink 3 are positioned higher than the central part 9, and exposed on both ends of the upper surface of a resin member 8. The central part 9 of the plate 3 is exposed in the central part of the lower surface of the resin member 8. The heat generated from the pellet 2 is dissipated from the central part 9 to a circuit board, and dissipated from both end portions 10 to outside air by the heat sink 3.