SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

摘要

An insulation film (3) having openings (3a) on respective electrode pads (2) for I/O terminals are formed on a semiconductor chip (1a) and a plurality of connecting electrodes (4) are provided thereon in contact with the respective pads (2) through the openings (3a). A thermoplastic resin (5) is provided on the connecting electrodes (4). A plurality of conductive particles (9) (preferably ten or more particles) are attached to the resin (5) or contained in the resin (5), thus constituting a semiconductor device (1). When the semiconductor device (1) is mounted on a board provided with a wiring pattern, it is positioned such that the connecting electrodes (4) face predetermined wirings. When the resin is heated while being pressed against a board coated with an insulating resin, the connecting electrodes (4) are electrically connected with the wiring through the conductive particles (9) between them.