| 摘要 |
PROBLEM TO BE SOLVED: To highly precisely supply solder to a board face by heat transfer by using a heat transfer technique instead of screen printing. SOLUTION: This device is provided with a board support means (fixed stage 1) for supporting a print board 2, heat transfer head 11, heat transfer solder sheet carrying and winding mechanism 12 for supplying a heat transfer solder sheet 20 in which a solder layer is formed on a base film to a heat transfer head 11, and head moving mechanism 10 for changing the relative position of the heat transfer head 11 and the board support means. In this case, the heat transfer solder sheet 20 is brought into contact with the print board 2, so that heat transfer can be attained.
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