| 摘要 |
PROBLEM TO BE SOLVED: To effectively and evenly clean the substrate surface of a semiconductor wafer by nozzle jetting of cleaning liquid. SOLUTION: A semiconductor wafer 110 is held with a suction head 120 for rotation. A supply nozzle 130 is provided cross the rear-surface side of the semiconductor wafer 110. The supply nozzle 130 has a slit-like cleaning liquid supply opening, and the cleaning liquid supply opening is provided in the radial direction of the semiconductor wafer 110 with one end part provided near the suction head 120, while the other end part is near the outer peripheral part of the semiconductor wafer 110. The cleaning liquid jetted from the cleaning liquid supply opening is supplied to the entire rear surface of the semiconductor wafer 110. Thus, the entire rear surface of the semiconductor wafer 110 is cleaned without exception.
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