发明名称 NON-CONTACT IC LABEL
摘要 <P>PROBLEM TO BE SOLVED: To provide a non-contact IC label which can be recovered by easily detaching a non-contact IC main body after sticking the non-contact IC label on an adherend. <P>SOLUTION: The non-contact IC label main body 11 is stuck on an adherend 20, for example, a cardboard box with an adhesive 2 as shown in Figure. When recycling the adherend 20 and trying to detach the non-contact IC label main body 11 from the adherend 20, the surface of a pseudo-adhesive layer 4 in contact with an adherend base material 3 is detached from the detachment beginning part 12. Thus, the non-contact IC main body 7 is detached as a detachment part 15 in the state of being held between a surface base material 9 with an adhesive layer 8 and the pseudo-adhesive layer 4, and the adhesive layer 2 and the adherend base material 3 are left on the adherend 20 as an adhesive part 16. Therefore, the non-contact IC label main body 11 can be separated into the detachment part 15 including the non-contact IC main body requiring separation and the adhesive part 16 similar to a general adhesive label. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005234115(A) 申请公布日期 2005.09.02
申请号 JP20040041552 申请日期 2004.02.18
申请人 SATO CORP 发明人 WATANABE ISAO
分类号 B42D15/10;G06K19/07;G06K19/077;G09F3/00 主分类号 B42D15/10
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