发明名称 |
Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
摘要 |
A method of manufacturing a thin film integrated circuit device according to the present invention includes steps of forming a peel-off layer over a thermally oxidized silicon substrate, forming a plurality of thin film integrated circuit devices over the peel-off layer with a base film interposed therebetween, forming a groove between the plurality of thin film integrated circuit devices, and separating the plurality of thin film integrated circuit devices by introducing one of a gas and a liquid including halogen fluoride into the groove to remove the peel-off layer. |
申请公布号 |
US7271076(B2) |
申请公布日期 |
2007.09.18 |
申请号 |
US20040007645 |
申请日期 |
2004.12.09 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI SHUNPEI;TAKAYAMA TORU;KANNO YOHEI |
分类号 |
H01L21/46;G06K19/07;G06K19/077;H01L21/00;H01L21/30;H01L21/68;H01L21/762;H01L21/82;H01L23/02;H01L23/498;H01L27/00 |
主分类号 |
H01L21/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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