发明名称 Leadframe alteration to direct compound flow into package
摘要 A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of the frame at a first transition point. The upward slope facilitates the upward flow of the molding compound entering from a bottom gate. Likewise, the leadframe also directs flow in a top gated mold by reversing the orientation of the leadframe or by forming a reverse downset on the leadframe.
申请公布号 US7271036(B2) 申请公布日期 2007.09.18
申请号 US20050215233 申请日期 2005.08.30
申请人 MICRON TECHNOLOGY, INC. 发明人 JAMES STEPHEN L.
分类号 H01L21/00;H01L21/44;H01L21/48;H01L21/50;H01L21/56;H01L23/495 主分类号 H01L21/00
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