发明名称 |
DIE MOUNTING STRESS ISOLATOR |
摘要 |
One method of the present invention includes preparing a die with traces and pads as desired for the intended use of the die. A MEMS device is mounted to the die. The die is then mounted to a substrate of the same material as the die. The substrate is then mounted to a package. The die and/or the substrate may be flip-chip mounted. |
申请公布号 |
US2008315397(A1) |
申请公布日期 |
2008.12.25 |
申请号 |
US20070765322 |
申请日期 |
2007.06.19 |
申请人 |
HONEYWELL INTERNATIONAL, INC. |
发明人 |
ESKRIDGE MARK H. |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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