Au-Sn-Ag-BASED SOLDER ALLOY AND SOLDER MATERIAL, SEALED ELECTRONIC COMPONENT USING THE SOLDER ALLOY OR SOLDER MATERIAL AND ELECTRONIC COMPONENT MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an Au-Ag-Sn-based solder alloy for high temperature which is excellent in reflow wettability, which can be sufficiently used even at the reflow bonding of a crystal device, a SAW filter, MEMS and the like and which is especially inexpensive and excellent in solder workability, reflow wettability and reliability.SOLUTION: An Au-Sn-Ag-based solder alloy which is composed of Sn, Ag, Au and inevitable elements in production and which has a composition adjusted to have a solidus of within 280-400°C and a liquidus of within 40°C is provided.SELECTED DRAWING: Figure 1