发明名称 COOLING DEVICE
摘要 Provided is a cooling device with which cooling performance can be improved while configuring the entire cooling device more compactly. This cooling device 100 is equipped with: a base block 20 having a mounting surface 21a in which heat-generating bodies 10 are mounted along the up-down direction; pipe units 30, comprising tanks 31 storing a refrigerant 60 and embedded in the opposite surface 21b from the mounting surface 21a of the base block 20, and multiple pipes 32 parallel to each other and connected in an upright manner to a side surface of the tanks 31; and multiple heat radiation fins 40 attached to the multiple pipes 32, with the pipes 32 penetrating the fins. The tanks 31 are provided with a flattened shape in which the thickness t2 in the thickness direction of the base block 20 is less than the height h2 in the up-down direction, and the pipes 32 are connected at a location on the upper part of the tanks 31.
申请公布号 WO2016104727(A1) 申请公布日期 2016.06.30
申请号 WO2015JP86286 申请日期 2015.12.25
申请人 MITSUBISHI ALUMINUM CO.,LTD. 发明人 TAKEMURA, HIROSHI;SUEKI, YASUHITO;SATA, SHUN-ICHI;HISANO, TOKIO
分类号 F28D15/02;H01L23/427 主分类号 F28D15/02
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