| 摘要 |
The present invention relates to an ingot slicing apparatus which prevents slurry and a wafer from being contaminated by removing copper caused by the abrasion of a wire. The present invention provides an ingot slicing apparatus comprising: a table to the bottom of which an ingot is fixated to move the ingot up and down; a wire coated with brass, provided to cut the ingot fixated to the table; a pair of main rollers provided below the table, wherein the wire is wound to be rotated; a slurry supply nozzle to supply slurry to the wire wound on the main rollers; a slurry collection line to collect slurry which has been used for the wire wound on the main rollers; and a coating removing unit for removing the brass coated on the wire supplied to the main rollers. |
