| 摘要 |
PROBLEM TO BE SOLVED: To provide an image sensor unit connecting a light source substrate and a sensor substrate with a lead wire with improved dust resistance.SOLUTION: An insertion hole 46 is formed on a sensor substrate 40. A lead wire 33 is connected to a lower surface 43 of the sensor substrate 40 from a light source substrate 30 through the insertion hole 46. The insertion hole 46 is closed with a closing member 22.SELECTED DRAWING: Figure 1 |
