| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-circuit board having a thin board thickness in which a circuit supporting miniaturization, high current, and heat dissipation can be easily formed, and a method for manufacturing the same.SOLUTION: The printed-circuit board comprises: a laminated board 5 including an insulating cloth material 1, a circuit part 2 formed on at least one surface of the insulating cloth material 1, an insulating resin layer 3 laminated on and impregnated in both surfaces of the insulating cloth material 1 in which the circuit part 2 is formed, and a conductive metal foil 4 stuck onto the insulating resin layer 3; and a conductor layer 6 in which a surface layer is formed on a surface of the laminated board 5 together with the conductive metal foil 4.SELECTED DRAWING: Figure 1 |
