发明名称 SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, ELECTROOPTIC DEVICE AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device, a semiconductor device manufacturing method, an electrooptic device and an electronic apparatus, which can improve reliability.SOLUTION: A semiconductor device 50 comprises: a semiconductor element such as a transistor provided on a first substrate 31; a packaging terminal 32 electrically connected with the semiconductor element and an inspection terminal 33 electrically connected with the semiconductor element. Quality of a material of the packaging terminal 32 surface and quality of a material of the inspection terminal 33 are different from each other.SELECTED DRAWING: Figure 3
申请公布号 JP2016127172(A) 申请公布日期 2016.07.11
申请号 JP20150000675 申请日期 2015.01.06
申请人 SEIKO EPSON CORP 发明人 KASAI TOSHIYUKI;MURATA KENJI
分类号 H01L21/822;G02F1/1345;G09F9/30;H01L27/04;H01L51/50;H05B33/06;H05B33/10;H05B33/12;H05B33/22 主分类号 H01L21/822
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