发明名称 |
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, ELECTROOPTIC DEVICE AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, a semiconductor device manufacturing method, an electrooptic device and an electronic apparatus, which can improve reliability.SOLUTION: A semiconductor device 50 comprises: a semiconductor element such as a transistor provided on a first substrate 31; a packaging terminal 32 electrically connected with the semiconductor element and an inspection terminal 33 electrically connected with the semiconductor element. Quality of a material of the packaging terminal 32 surface and quality of a material of the inspection terminal 33 are different from each other.SELECTED DRAWING: Figure 3 |
申请公布号 |
JP2016127172(A) |
申请公布日期 |
2016.07.11 |
申请号 |
JP20150000675 |
申请日期 |
2015.01.06 |
申请人 |
SEIKO EPSON CORP |
发明人 |
KASAI TOSHIYUKI;MURATA KENJI |
分类号 |
H01L21/822;G02F1/1345;G09F9/30;H01L27/04;H01L51/50;H05B33/06;H05B33/10;H05B33/12;H05B33/22 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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