METHOD FOR REMOVING MULTILAYER RESIST AND PLASMA PROCESSING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for removing a multilayer resist capable of improving productivity, and a plasma processing device.SOLUTION: In a method for removing a multilayer resist according to an embodiment, a multilayer resist including a first film provided on a substrate and containing a first organic material, a second film provided on the first film and containing an inorganic material, and a third film provided on the second film and containing a second organic material is removed. The method for removing a multilayer resist includes the steps of: removing the first film and the third film by first neutral active species generated using plasma; and removing the second film by second neutral active species generated using the plasma or a process liquid. In the steps of removing the first film and the third film, a penetration part penetrating through the second film is formed such that temperature of the multilayer resist is higher than temperature of the pre-bake temperature of the first film.SELECTED DRAWING: Figure 1