| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emission device and a mounting method for the same that can reduce damage of a wavelength conversion member when the light emission device having the wavelength conversion member is subjected to flip-chip mounting by using electrically conductive adhesive agent requiring a load, and a method of manufacturing a light source device using the light emission device.SOLUTION: A light emission device 100 has a semiconductor light emission element 1 having an electrode at one surface side of a semiconductor laminate body 12, and a wavelength conversion member 2 containing particles 21 of wavelength conversion material in translucent resin 22 at the other surface side of the semiconductor laminate body 12. The one surface side is set as a mounting surface, electrically conductive adhesive agent 80 containing electrically conductive particles 81 in resin 82 is used, and a load is imposed from the other surface side, thereby performing mounting. The light emission device 100 has a support member 3 for supporting the load. A direction vertical to the other surface is set as a height direction, and when the other surface is located at a higher position than the one surface, the upper end of the support member 3 is not less than the height of the upper end of the particle-contained portion of the wavelength conversion member 2, and the lower end of the support member 3 is not higher than the height of the lower surface of the wavelength conversion member 2.SELECTED DRAWING: Figure 4A |
