发明名称 Semiconductor arrangement having first semiconductor device over first shallow well having first conductivity type and second semiconductor device over second shallow well having second conductivity type and formation thereof
摘要 A semiconductor arrangement and method of formation are provided. A semiconductor arrangement includes a first semiconductor device adjacent a second semiconductor device. The first semiconductor device includes a first gate over a first shallow well in a substrate. A first active area is in the first shallow well on a first side of the first gate. The second semiconductor device includes a second gate over a second shallow well. A third active area is in the second shallow well on a first side of the second gate. The second shallow well abuts the first shallow well in the substrate to form a P-N junction. The P-N junction increases capacitance of the semiconductor arrangement, as compared to a device without such a P-N junction.
申请公布号 US9401361(B2) 申请公布日期 2016.07.26
申请号 US201414178454 申请日期 2014.02.12
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED 发明人 Yen Hsiao-Tsung;Luo Cheng-Wei
分类号 H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119;H01L27/092;H01L21/8238 主分类号 H01L29/76
代理机构 Cooper Legal Group, LLC 代理人 Cooper Legal Group, LLC
主权项 1. A semiconductor arrangement comprising: a first semiconductor device comprising: a first gate over a first shallow well formed in a substrate, the first shallow well comprising a first conductivity type;a first active area in the first shallow well on a first side of the first gate; anda second active area in the first shallow well on a second side of the first gate; a second semiconductor device comprising: a second gate over a second shallow well formed in the substrate, the second shallow well comprising a second conductivity type;a third active area in the second shallow well on a first side of the second gate; anda fourth active area in the second shallow well on a second side of the second gate, a sidewall of the first shallow well abutting a sidewall of the second shallow well; and a third semiconductor device comprising: a third gate over a third shallow well formed in the substrate, the third shallow well comprising the first conductivity type;a fifth active area in the third shallow well on a first side of the third gate; anda sixth active area in the third shallow well on a second side of the third gate, a second sidewall of the second shallow well abutting a sidewall of the third shallow well, and wherein: the first active area and the sixth active area are coupled to a first voltage supply;the first gate, the third active area, the fourth active area and the third gate are coupled to a second voltage supply; andthe second active area, the second gate and the fifth active area are coupled to a third voltage supply.
地址 Hsin Chu TW