Molding structure for wafer level package

摘要

Apparatus, and methods of manufacture thereof, in which a molding compound is formed between spaced apart microelectronic devices. The molding compound comprises micro-filler elements. No boundary of any of the micro-filler elements is substantially parallel to a substantially planar surface of the molding compound, or to a substantially planar surface of any of the microelectronic devices.

主权项

1. A method, comprising:
forming a sacrificial layer over a plurality of microelectronic devices, including over an electrical contact of each microelectronic device, wherein the microelectronic devices are coupled together by a first substrate; separating the plurality of microelectronic devices from each other to form separated microelectronic devices; coupling the separated microelectronic devices to a second substrate; and forming a molding compound on the second substrate around each microelectronic device while leaving exposed an area of the sacrificial layer overlying the electrical contact of each microelectronic device.