| 发明名称 | Method of singulating LED wafer substrates into dice with LED device with Bragg reflector | ||
| 摘要 | A method of dicing semiconductor devices from a substrate includes forming a Bragg reflector over a bottom side of the substrate, where the bottom side is opposite of a top side, generating a pattern of defects in the substrate with a laser beam from the bottom side of the substrate, and applying pressure to the substrate to dice the substrate along the pattern of defects. The Bragg reflector includes a first layer of dielectric material having a first index of refraction and a second dielectric material having a second index of refraction different from the first index of refraction. | ||
| 申请公布号 | US9419185(B2) | 申请公布日期 | 2016.08.16 |
| 申请号 | US201514605200 | 申请日期 | 2015.01.26 |
| 申请人 | GLO AB | 发明人 | Herner Scott Brad |
| 分类号 | H01L33/00;H01L33/46;H01L33/18;H01L33/32;H01L33/08 | 主分类号 | H01L33/00 |
| 代理机构 | The Marbury Law Group PLLC | 代理人 | The Marbury Law Group PLLC |
| 主权项 | 1. A method of dicing semiconductor devices from a substrate, comprising: forming a Bragg reflector over a bottom side of the substrate, wherein the bottom side is opposite of a top side and the Bragg reflector comprises a first layer of dielectric material having a first index of refraction and a second dielectric material having a second index of refraction different from the first index of refraction; forming a plurality of LED layers over the top side of the substrate, wherein the semiconductor devices comprise LED dice; generating a pattern of defects in the substrate with a laser beam from the bottom side of the substrate; and applying pressure to the substrate to dice the substrate along the pattern of defects. | ||
| 地址 | Lund SE | ||