发明名称 |
MIM capacitors with improved reliability |
摘要 |
A capacitor and methods for forming the same are provided. The method includes forming a bottom electrode; treating the bottom electrode in an oxygen-containing environment to convert a top layer of the bottom electrode into a buffer layer; forming an insulating layer on the buffer layer; and forming a top electrode over the insulating layer. |
申请公布号 |
US9418999(B2) |
申请公布日期 |
2016.08.16 |
申请号 |
US201414525412 |
申请日期 |
2014.10.28 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Wu Chih-Ta;Lee Jason;Wang Chung Chien;Lin Hsing-Lien;Wang Yu-Jen;Tu Yeur-Luen;Hsu Chern-Yow;Liu Yuan-Hung;Lo Chi-Hsin;Tsai Chia-Shiung |
分类号 |
H01L21/8234;H01L21/8244;H01L27/108;H01L49/02 |
主分类号 |
H01L21/8234 |
代理机构 |
Slater Matsil, LLP |
代理人 |
Slater Matsil, LLP |
主权项 |
1. A device comprising:
a bottom electrode comprising:
a metal layer; anda metal nitride layer over the metal layer; a metal oxynitride layer over the bottom electrode, wherein the metal oxynitride layer and the bottom electrode comprise same metals, wherein a first atom ratio of metal-to-nitrogen in the metal nitride layer is substantially equal to a second metal-to-nitrogen in the metal oxynitride layer; an insulating layer over the metal oxynitride layer; and a top electrode over the insulating layer. |
地址 |
Hsin-Chu TW |