发明名称 MIM capacitors with improved reliability
摘要 A capacitor and methods for forming the same are provided. The method includes forming a bottom electrode; treating the bottom electrode in an oxygen-containing environment to convert a top layer of the bottom electrode into a buffer layer; forming an insulating layer on the buffer layer; and forming a top electrode over the insulating layer.
申请公布号 US9418999(B2) 申请公布日期 2016.08.16
申请号 US201414525412 申请日期 2014.10.28
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Wu Chih-Ta;Lee Jason;Wang Chung Chien;Lin Hsing-Lien;Wang Yu-Jen;Tu Yeur-Luen;Hsu Chern-Yow;Liu Yuan-Hung;Lo Chi-Hsin;Tsai Chia-Shiung
分类号 H01L21/8234;H01L21/8244;H01L27/108;H01L49/02 主分类号 H01L21/8234
代理机构 Slater Matsil, LLP 代理人 Slater Matsil, LLP
主权项 1. A device comprising: a bottom electrode comprising: a metal layer; anda metal nitride layer over the metal layer; a metal oxynitride layer over the bottom electrode, wherein the metal oxynitride layer and the bottom electrode comprise same metals, wherein a first atom ratio of metal-to-nitrogen in the metal nitride layer is substantially equal to a second metal-to-nitrogen in the metal oxynitride layer; an insulating layer over the metal oxynitride layer; and a top electrode over the insulating layer.
地址 Hsin-Chu TW