Semiconductor device

摘要

A semiconductor device includes a package substrate, an IF chip, and a core chip. The package substrate has: first electrodes aligned and disposed on a first rear surface; second electrodes aligned and disposed in the first direction (Y direction) on a first front surface; and wiring that electrically connects the first electrodes and the second electrodes. The IF chip has third electrodes bonded to the second electrodes. The core chip is connected to the IF chip. In the first direction, the length of the IF chip is more than that of the core chip but equal to or less than that of the package substrate. One of the first electrodes is disposed further toward the outside than a core chip end portion in the first direction. At least one of the second electrodes is disposed further toward the outside than the core chip end portion in the first direction.

主权项

1. A semiconductor device comprises:
a package substrate comprising a plurality of first electrodes arranged on a first reverse surface, a plurality of second electrodes arranged along a first direction on a first obverse surface on the opposite side to the first reverse surface, and wiring lines which electrically connect the first electrodes and the second electrodes; an interface chip which is provided on the first obverse surface of the package substrate and which comprises a plurality of third electrodes which are arranged on a second reverse surface which faces the package substrate, and which are joined to the plurality of second electrodes; and a core chip which is provided on a second obverse surface on the opposite side to the second reverse surface of the interface chip, and which is electrically connected to the interface chip; wherein the length of the interface chip in the first direction is greater than the length of the core chip in the first direction, and is at most equal to the length of the package substrate in the first direction; at least one of the plurality of first electrodes is disposed to the outside of the end portion of the core chip in the first direction; and at least one of the plurality of second electrodes is disposed to the outside of the end portion of the core chip in the first direction.