| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can supply a process liquid also to an undersurface of a substrate while preventing deflection of the substrate while securely holding the substrate.SOLUTION: In a substrate processing apparatus, an edge part of a substrate W is held hy a plurality of chuck pins 20 and a nitride gas is jetted from a discharge port 56 of a nozzle head 50 to suck to a suction face 53 in a noncontact manner, a region of the substrate W opposite to the suction face 53 by a Bernoulli effect. Despite the thin substrate W, the substrate W can be securely held on a spin base 10 and deformation of the substrate W is inhibited and breakage of the substrate W can be prevented even when the substrate W is rotated. In addition, since the edge part of the substrate W is mechanically held by the plurality of chuck pins 20, even when the nitrogen gas and a process liquid are concurrently discharged from the discharge port 56 of the nozzle head 50, the substrate W is not pushed up by pressure of the process liquid thereby to cause the Bernoulli effect to be maintained.SELECTED DRAWING: Figure 2 |
