| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component and a mount board thereof.SOLUTION: The multilayer ceramic electronic component comprises: a ceramic main body including a capacity formation layer having a plurality of first and second dielectric layers alternately disposed; and external electrodes disposed on opposite side surfaces in a length direction thereof. The capacity formation layer includes first and second internal electrodes disposed away from each other on the first dielectric layers, exposed on opposite side surfaces in the length direction of the ceramic main body, and connected to the external electrodes, a first floating electrode disposed away from the first and second internal electrodes, and a second floating electrode disposed on the second dielectric layers and overlapping with a part of the first and second internal electrodes. The ceramic main body further includes a protective layer including a plurality of third dielectric layers disposed between the capacity formation layer and at least one of the upper surface and the lower surface thereof, having first and second dummy electrodes exposed on opposite side surfaces in the length direction of the ceramic main body, and having a plurality of third dummy electrodes disposed away from each other between the first and second dummy electrodes.SELECTED DRAWING: Figure 2 |
