Stack package and reduction of standby current

摘要

The stack package includes: a plurality of chips each stacked with a plurality of layers; and a plurality of pads respectively formed on the plurality of chips. Each chip includes: a ground path unit configured to form a current path between a pad and a ground stage; a selection unit configured to selectively control a connection path electrically coupled to the pad according to a chip enable signal; and a controller configured to selectively control a connection between the selection unit and the ground path unit according to a control signal.

主权项

1. A stack package comprising:
a plurality of chips each stacked with a plurality of layers; and a plurality of pads respectively formed on the plurality of chips, wherein each of the chips includes:
a ground path unit configured to form a current path between a pad and a ground stage;a selection unit configured to selectively control a connection path electrically coupled to the pad according to a chip enable signal; anda controller configured to selectively control a connection between the selection unit and the ground path unit according to a control signal,wherein the selection unit connects the pad to the controller when the chip enable signal is activated, and severs a connection between the pad and the controller during a standby mode in which the chip enable signal is deactivated.