发明名称 SPOT PLATING METHOD FOR LEAD FRAME
摘要 PURPOSE:To treat a flaw of several dozen mum existing in the surface of a blank, and to improve adhesive properties of plating by introducing an electrolytic process by an alkaline solution after etching activation by an acid, washing the blank and plating the blank with silver. CONSTITUTION:A blank is activated by hydrochloric acid, etc., and treated by potessium hydroxide, sodium hydroxide, etc. Even when there is a flaw of several dozen mum in the surface of the blank and an acid content on the acid treatment by hydrochloric acid, etc. remains in the flaw, the acid content is neutralized and trated. Metallic fine powder is driven out by H2 gas during electrolysis, and has an extremely excellent effect on the adhesive properties of subsequent silver plating. Hydrochloric acid, phosphoric acid, etdc. are used as an acid treating liquid and potassium hyroxide, sodium hydroxide, etc. as an alkaline solution.
申请公布号 JPS61220362(A) 申请公布日期 1986.09.30
申请号 JP19850062932 申请日期 1985.03.26
申请人 SUMITOMO ELECTRIC IND LTD 发明人 TANI KATSUTO;HASHIMOTO YOSHIKAZU
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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