| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the thickness of overall device and to make operations of conductive connection of semiconductor chips appropriate by eliminating the need for complex working on a supporting member for supporting semiconductor chips, such as substrates with the aim of realizing a high-density mounting of semiconductor chips by adopting the so-called chip-on-chip structure. SOLUTION: A first semiconductor chip 2A, provided with terminals 21 on its major surface 20A and a second semiconductor chip 2B provided with terminals 22 on its major surface 20B, are mounted on a desired supporting member 1 in such a way that the second semiconductor ship 2B is stacked on the first semiconductor chip 2A. In this case, the first semiconductor chip 2A is disposed under the supporting member 1 with its major surface 20A oriented upward. Also, though-holes 12 are formed in the supporting member 1 in the direction of its thickness, so that the top of the terminals of the first semiconductor chip 2A is not covered with the supporting member 1.</p> |
