| 摘要 |
<p>PURPOSE:To mount/dismount a microcomputer freely by mounting only the microcomputer on a wiring board, accommodating the wiring board in a hole made at a desired position of a casing material, arranging a plurality of circuit elements on a substrated superposed by the wiring board, and arranging high electronic parts at positions on the substrate where the substrate is not superposed by the wiring board. CONSTITUTION:Power circuit elements 4 producing heat are mounted on a substrate 2 superposed by a wiring board 8, and a plurality of circuit elements 4 such as chip capacitors are mounted substantially on the entire area of the substrate 2. Circuit elements 4 having low profiles are mounted in such a manner. A hole 5 is made at a desired position of a casing material 6, and the wiring board 8 mounting a microcomputer 7 is disposed for accommodation in the space defined by the hole 5 and connected with conducting paths 3 formed on the substrate 2. By such arrangement, the microcomputer 7 having desired control features can be mounted/dismounted freely under a state where the circuit elements 4 mounted on the substrate 2 are sealed hermetically against the casing material 6.</p> |
