发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve device characteristics while coping with manufacture of a variety of devices by patterning the same layer using a plurality of exposure systems and lithography systems. CONSTITUTION:A semiconductor chip is designed to divide its chip into functional cells, which form standard cell sections 1, 3, 4 and 5, and a custom cell section 2. The standard cell sections are patterned quickly through exposure with an i-line stepper; the custom cell section 2 covered with the same resist is patterned by lithography using an Ar laser (3638Angstrom harmonic). In other words, the different sections on the same layer are individually subjected to lithographic processes using light sources capable of emitting light to which the same resist layer is sensitive. According to this method, it is possible to improve characteristics without a decrease in throughput and to provide custom devices so that many kinds of devices in small volume can be manufactured efficiently.
申请公布号 JPH03238808(A) 申请公布日期 1991.10.24
申请号 JP19900034744 申请日期 1990.02.15
申请人 SEIKO EPSON CORP 发明人 UMEDA KATSUMI
分类号 H01L21/027;G03F7/20 主分类号 H01L21/027
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