| 摘要 |
PURPOSE:To prevent a decrease in reliability due to solder flow by providing a solder flow preventive wall for preventing the flow in the case of placing a semiconductor chip on a die pad area from flowing out to a wire bonding area. CONSTITUTION:A board 1, a metallized layer 2 formed on the board 1 and having a die pad area 15 and a wire bonding area 16, and a solder flow preventive wall 7 formed between the areas 15 and 16 on the layer 2 and preventing solder flow in the case of placing a semiconductor chip 9 on the area 15 from flowing out to a wire bonding area are provided. Accordingly, the wall 7 formed on the layer 2 prevents the flow from flowing out to the area 16 at the time of placing the chip on the area 15. Thus, a decrease in reliability due to the flow can be prevented. |
