| 摘要 |
<p>PURPOSE:To make it possible to constitute compactly a device and to make possible a high- accuracy positioning of a chip by a method wherein an installation surface to be provided with a semiconductor element is used as a reflective surface and the optical path of an imaging system for imaging the element and at least one part of the optical path of a lighting system for lighting the element are provided on the same optical path. CONSTITUTION:A mounting surface to be mounted with a chip 2 is formed on a reflective surface 11a. One part of lead rows on the two sides intersecting orthogonally to each other of the chip 2 is irradiated with light from one piece of a light source 13, such as an LED or the like, via a half mirror 14. One part of the lead rows on the two sides intersecting orthogonally to each other of the chip 2 is imaged by an imaging system, such as a camera 15 or the like, in a state that the optical path of a lighting system is made to coincide with at least one part of the optical path of the imaging system. The chip 2 and the reflective surface 11a of an inspecting stand 11 are respectively binarized into a black and a white by an image receiving signal using the camera and an image pickup is executed. The position of the center of gravity of an imaging part is calculated on the basis of this imaged information. The calculated position is compared with information on the reference position of the center of gravity at the time when a teaching is previously executed and the amount of positional deviation of the position of the center of gravity of the imaging part is found. The position of the stand 11 is corrected to a prescribed position by X-Y and Z-theta stage mechanism using detected results and the alignment of the chip 2 is performed with high accuracy.</p> |
