| 摘要 |
PURPOSE:To realize a high-density interconnection by a method wherein pads are formed to end edge parts at three sides of an IC. CONSTITUTION:An IC 10 is provided with pads 11, for bonding use, which have been formed to end edge parts at its three sides. For example, a pad train is divided into two each at end edge parts on both the right side and the left side so as to be nearly half each; a pad train at an end edge part on the upper side is not divided. At the pad train on the left side, the order of the pad train on one side is decided to be in the direction of an arrow 1, and the order of the pad train on the other side is decided to be in the direction of an arrow 2. In the same manner, the order of the pad train on the right side is decided in such a way that the pad train on one side is set to be in the direction of an arrow 4 and that the pad train on the other side is set to be in the direction of an arrow 5. The pad train on the upper side is set to the order in the direction of an arrow 3. |
