| 摘要 |
PURPOSE:To reduce the size of a solid-state imaging device, and to improve the productivity thereof by molding a base made of thermoplastic resin while leadframes are embedded therein, and welding the base while it is covered with a cap made of thermoplastic resin after a solid-state imaging element has been mounted on the base. CONSTITUTION:When a base 1 made of thermoplastic resin is produced by injection molding, leadframes 2 are embedded in the base 1, and inner leads 21 are exposed in the vicinity of a mounting area 11 on the upper surface of the base 1. Outer leads 22 are extended downwards from, for example, the sides of the base 1. A solid-state imaging element 3 is bonded to the mounting area 11 of the base 1, and the solid-state imaging element 3 and the exposed inner leads 21 on the upper surface of the base 1 are wired together. Then, a cap 4 made of thermoplastic resin is mounted on the base 1, and these are welded together by the use of an ultrasonic transducer 5. Thus, a solid-state imaging device that has the solid-state imaging element 3 housed between the base 1 and the cap 4 is manufactured. |
