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发明名称
HEAT SINK FOR COOLING DOWN SEMICONDUCTOR ELEMENT
摘要
申请公布号
JPH06252304(A)
申请公布日期
1994.09.09
申请号
JP19930036625
申请日期
1993.02.25
申请人
TOSHIBA CORP
发明人
UMEDA KATSUYA;HASHIMOTO TAKASHI
分类号
H01L23/427;(IPC1-7):H01L23/427
主分类号
H01L23/427
代理机构
代理人
主权项
地址
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