发明名称 COMBINING METHOD AND APPARATUS USING SOLDER
摘要 Under an atmospheric pressure or a pressure in the vicinity thereof, electric discharge is generated by using a predetermined gas as a medium, and a surface of a material to be treated is exposed to an excited gas or an active seed gas, such as ions formed in the mentioned gas owing to the discharge atmosphere. Simultaneously with or after the exposure of the surface, the material to be treated is subjected to soldering using flux of low corrosiveness or not using flux at all. After the soldering operation, the surface of the object material is exposed to an active seed gas so as to remove organic substances, such as flux.
申请公布号 WO9515832(A1) 申请公布日期 1995.06.15
申请号 WO1994JP00573 申请日期 1994.04.06
申请人 SEIKO EPSON CORPORATION;MIYAKAWA, TAKUYA;MORI, YOSHIAKI;KURASHIMA, YOHEI;ANAN, MAKOTO 发明人 MIYAKAWA, TAKUYA;MORI, YOSHIAKI;KURASHIMA, YOHEI;ANAN, MAKOTO
分类号 B23K1/20;(IPC1-7):B23K1/20;H05K3/34 主分类号 B23K1/20
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